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  • Through Silicon Via AFVI


    Die attach Inspection

▪ 2D inspection with good resolution
▪ 3D height measurement of the attached components
▪ Multiple handling of various types of packaging
   - JEDEC tray, SUS tray, strip, etc.
▪ IR optics for inspection through silicon
* Optional stage heating

▪ IR Inspection

▪ BLT Measurement