▪ High throughput with dual lens system
▪ Chip inspection after sawing
▪ Kerf inspection
▪ Advanced D2D algorithm using golden die extracted from
   neighboring 4 dies
▪ Verifying review module included
▪ Self-developed lens for wide field of view and good
   resolution
▪ Real time auto focusing module adopted
▪ Optional IR inspection to inspect defects, cracks and
   chippings inside silicon.

  

- Crack Inspection
  Wafer thinning & Dicing cut

  

- 3D Bump Inspection