Concept

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    2D Application

▪ Nano imaging: 100~700nm/pixel

  - Wafer Pattern Inspection
  - Wafer Particle Counter


 

▪ Micro imaging: 1~20㎛/pixel

  - Wafer Pattern Inspection
  - PCB inspection

▪ Color inspection: 5~20 ㎛/pixel

  - PCB inspection



    3D Technology

▪ ATI Triangulation Bump

▪ White light interferometer TSV