PCB

Automatic Final Vision Inspection for IC Package substrate. As Industry Standard AFVI, Available for Various Substrate Products Available for 2um~5.5um Resolution depends on Substrate Product Model Inspect various types of products such as BOC, CSP, UTC, SiP, PBGA, MMC, FC-CSP (Non SOP Type), BOL, FC-CSP (SOP Type,

Automatic Final Vision Inspection for IC Package substrate. Inspect various types of products such as BOC, CSP, UTC, SiP, PBGA, MMC, FC-CSP (Non-SOP) Multiple handling of various sizes of products (W)40~120mm, (L)100~300mm, (T)0.06mm and 1.50mm High throughput with color processing