Products
Wafer Macro Inspection System Higher Resolution Optics Color Macro Inspection 4 Objective Lenses NAC(Numerical Aperture Controller Backside Inspection with IR Color Backside Inspection PBI(Post Bonding Inspection) Enhanced 3D Optic Edge Inspection EBR Measurement Full Area Inspection on Wafer
Reticle Outgoing Equipment Pattern Array Orientation Pattern Discolor Pellicle Orientation Pellicle Haze Pellicle Swell Pellicle Foreign Materials
Auto Scope System Auto Focus 2 types of review mode(Direct, Manual) Image Saving CD Measurement Overlay KLARF / MAP file Automation Overkill Review Camera : Color Verification 1M Area Camera Scope : 5X, 10X, 20X, 50X, 100X, 150X Repeatability : 1um@3σ
Package Inspection System 2D inspection with high resolution 3D height measurement of the attached components Multiple handling of various types of packaging JEDEC tray, SUS tray, strip, etc. IR optics for inspection through silicon
Laser Marking System IC Package Substrate Reject Marking / 2D Barcode & Serial No. Marking System Reject, 2D barcode and Serial Number Marking at once on Standard Machine Available for Electrolysis / Electroless / OSP Plating Products with ATI Specialized Marking Illumination High Marking Accuracy with 10um
Automatic Final Vision Inspection for IC Package substrate. As Industry Standard AFVI, Available for Various Substrate Products Available for 2um~5.5um Resolution depends on Substrate Product Model Inspect various types of products such as BOC, CSP, UTC, SiP, PBGA, MMC, FC-CSP (Non SOP Type), BOL, FC-CSP (SOP Type,
Automatic Final Vision Inspection for IC Package substrate. Inspect various types of products such as BOC, CSP, UTC, SiP, PBGA, MMC, FC-CSP (Non-SOP) Multiple handling of various sizes of products (W)40~120mm, (L)100~300mm, (T)0.06mm and 1.50mm High throughput with color processing
Reticle Inspection System MASK Inspection Pellicle Top Inspection Pellicle Bottom Inspection Pellicle Frame Inspection Back Side Inspection Automated Particle Cleaning Function
Wafer Inspection System High throughput with 2D and 3D optical system Chip inspection after sawing Kerf inspection Advanced D2D algorithm using golden die Verifying review module included Self-developed lens for wide field of view and high resolution Real time auto focusing module adopted Optional IR inspection to inspect
