2018 Summer Design Team Workshop(18.06.12~14)
Period 2018. 06. 12 ~ 14 Location 제주도 Pictures
2018 Summer QM Team Workshop(18.04.29)
Period 2018. 04. 29 Location 서울시 전역 Pictures
2018 Summer Software Team Workshop(18.05.17~18)
Period 2018. 05. 17 ~ 18 Location 고양 스타필드 북한산 인근 펜션 Pictures
OAK
Auto Scope System Auto Focus 2 types of review mode(Direct, Manual) Image Saving CD Measurement Overlay KLARF / MAP file Automation Overkill Review Camera : Color Verification 1M Area Camera Scope : 5X, 10X, 20X, 50X, 100X, 150X Repeatability : 1um@3σ
Cypress
Package Inspection System 2D inspection with high resolution 3D height measurement of the attached components Multiple handling of various types of packaging JEDEC tray, SUS tray, strip, etc. IR optics for inspection through silicon
LMS-400G
Laser Marking System IC Package Substrate Reject Marking / 2D Barcode & Serial No. Marking System Reject, 2D barcode and Serial Number Marking at once on Standard Machine Available for Electrolysis / Electroless / OSP Plating Products with ATI Specialized Marking Illumination High Marking Accuracy with 10um
AVIS-1800 Series
Automatic Final Vision Inspection for IC Package substrate. As Industry Standard AFVI, Available for Various Substrate Products Available for 2um~5.5um Resolution depends on Substrate Product Model Inspect various types of products such as BOC, CSP, UTC, SiP, PBGA, MMC, FC-CSP (Non SOP Type), BOL, FC-CSP (SOP Type,
PINE
Automatic Final Vision Inspection for IC Package substrate. Inspect various types of products such as BOC, CSP, UTC, SiP, PBGA, MMC, FC-CSP (Non-SOP) Multiple handling of various sizes of products (W)40~120mm, (L)100~300mm, (T)0.06mm and 1.50mm High throughput with color processing
SUN
Reticle Inspection System MASK Inspection Pellicle Top Inspection Pellicle Bottom Inspection Pellicle Frame Inspection Back Side Inspection Automated Particle Cleaning Function