Automatic Final Vision Inspection for
IC Package substrate.
- As Industry Standard AFVI, Available for Various Substrate Products
- Available for 2um~5.5um Resolution depends on Substrate Product Model
- Inspect various types of products such as BOC, CSP, UTC, SiP, PBGA, MMC, FC-CSP (Non SOP Type), BOL, FC-CSP (SOP Type, Magazine & Interleaf Handling)
- Interleaf Handling is available
